Dynaplate 12".For bonding, grounding and Loran use Improves performance of electronics and reduces RF interference Offers the best path for hull bonding without long runs of copper foil Equivalent to 40 square feet of copper foil Provides a direct, low resistance path for improved lighting protection Deters electrolysis and galvanic corrosion Sintered porous bronze sphere consturction for maximum conductivity in a compact size Low drag, non fouling shape Easy to install Conforms to ABYC standards Easy to clean with wire brush

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